FEATURED CASE | ENGINEERING EVIDENCE FILE

Cloud Simulation for Chip Packaging

Use cloud parallel solving and standardized benchmark and checking workflows to establish trusted package-reliability validation.

Intelligent designAdvanced ManufacturingAnonymized Case

The engineering challenge

Local environments cannot support large-scale multiphysics coupling effectively, and results lack a unified benchmark for correlation.

Check temperature, stress and warpage responses to support package reliability review.

Evidence and materials: The agreed structure, materials, conditions, and warpage correlation data form the baseline.
Applicability: For package tasks with defined materials, structures, conditions, and correlation baselines

02 / Materials

03 / Validation

Correlation Baseline · Metric Definition

Correlation Baseline: The agreed structure, materials, conditions, and warpage correlation data form the baseline.
Metric Definition: Temperature, stress, warpage response, and deviation from the benchmark
Validation Method: Multiphysics result checks, benchmark correlation, and a standard validation report
Disclosure and Confidentiality: The customer, design details, and source data are anonymized; the task structure, outcome types, and applicability are disclosed.

Implementation and reuse conditions

Simulation validation → Reliability review

For package tasks with defined materials, structures, conditions, and correlation baselines

Inputs for another use: Package geometry, materials and thermomechanical conditions
Revalidation needed: Check models, criteria and applicability again when the object, conditions or codes change.